FB high temperature flame retardant thermosetting phenolic resin (FB resin)

FB TEMPERATURE RESISTANCE/INFLAMMABILITY RESISTANCE THERMAL SOLIDIFICATION EPOXY RESIN
1. MAIN FEATURES
1) Deposition temp: more than 500 oC and remain 50% residual carbon rate at 1000 oC.
2) Oxygen index: 48.5, non-flammable and generally non-smoke and poison-less.
3) Linear burning loss ratio: 0.079mm/s, mass burning loss ratio: 0.0333g/s.
4) Various epoxy resin solidifying agents can be made, the test sample of steep strip bound with the prepared common epoxy resin is not dropped off at 800 oC/1h.

2. TECHNICAL DATA

Solid Contents GelatificationTime Free Phenol content
FB solid resin Yellow solid, without obvious impurities 70~100s (200 oC) <7% (military degree)<10% (normal application
FB resin alcohol solution Brown/red solution, without obvious impurities 45+/-5% (105oC+/-2 oC, 2h) 70~120s (200 oC) <7% (military degree)<10% (normal usage
Its shelve life is one year and it can be still used if it is qualified after retested.

3. APPLICATIONS
FB resin can be used to prepare HTR adhesives and coatings, new type anti-burning materials, C/C material, insolating materials, compound materials, friction materials, inflammable proof materials and refractory materials to be therefore applied in space-flight, aviation, military, electro-machinery, mobiles, electronic appliances, chemical anti-erosion, the high temp covering film sand in oil fields, abrasive materials/brake blocks, HTR brake shoes, film gelatin, the adhesives for lamp/lights’ head etc, especially suitable for blended with carbon fiber, graphite and common 2123# hydroxybenzene.

4. PACKING
FB resin (solid) is packed in paper/plastic drum with plastic bag inside or paper/plastic compound bag and the options from 20kg~25kg packages can be selected by customers. The liquid FB resin is packed in metal drum of both 20kg or 200 kg.

5. APPLICATIONS
(1) Crush the FB resin properly (the smaller granular, the faster resolving speed), after that fill same quantity industrial alcohol to be immersed for approx. 24 hours to let it resolved, the resolution can be quicken if toss, stir and heating be made. On the container bottom, if small quantity of turbid substances can be seen, it will not affect the use and no need to separate since the larger molecular particles resolved slowly under normal temperature. Then add other material portions if necessary, and now the binding and gelatification can be done.
The solidification process when it is under adhering: 120 oC/2h + 150oC/3h + 180oC/2h.
(2) The following process relating to hydroxybenzene can be referenced in case to prepare compound materials: raise appropriately the hot molding temp, heating temp and prolong the processing time.
(3) In case prepare epoxy-solidifying agent, add the epoxy into the alcohol base FB resin and well mix, after that it can be applied. Its desired weight ratio is at 1:1(FB resin calculated as pure stuff without taking the resolution into account).
The solidifying process: 120 oC/2h + 150oC/2h + 180oC/3h.
(4) In case manufacturing the anti-friction-substance, directly grind FB resin then mix with other materials in same proportion and finally mold.